The subject "Microelectronics" is divided into four modules:

• BLOCK 1. FUNDAMENTALS OF MICROELECTRONICS
• BLOCK 2. MAIN TECHNOLOGY PROCESSES IN MICROELECTRONICS
• BLOCK 3. TECHNOLOGIES OF INTEGRATED CIRCUITS
• BLOCK 4. DESIGN OF DIGITAL INTEGRATED CIRCUITS

• BLOCK 1. FUNDAMENTALS OF MICROELECTRONICS
  • Historical evolution.
  • Introduction to microelectronics.
  • Classification of materials.
  • Semiconductor substrates.
  • Semiconductor crystals.

• BLOCK 2. MAIN TECHNOLOGY PROCESSES IN MICROELECTRONICS
  • Introduction
  • Crystal growth
  • Manufacturing processes: Diffusion
  • Manufacturing processes: Thermal oxidation
  • Manufacturing processes: Ion implantation
  • Manufacturing processes: Rapid Thermal Processing (RTP)
  • Thin film

• BLOCK 3. TECHNOLOGIES OF INTEGRATED CIRCUITS
  • Photolithography
  • Photoresists and Non-optical Lithography
  • Vacuum Technology and Plasmas
  • Etching Techniques

• BLOCK 4. DESIGN OF DIGITAL INTEGRATED CIRCUITS
  • Packaging techniques
  • System packaging: levels of packaging
  • Interconnections in printed circuit boards
  • Modular assembly
  • Environmental and electrical considerations